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19-0673; Rev 1; 1/07
KIT ATION EVALU BLE AVAILA
Hex SPDT Data Switch
Features
Multiplex SDIO or Memory Stick Interfaces 1.8V to 5.5V Supply Voltage Range Low On-Resistance 4 (typ) Low-Capacitance Switches, 30pF (typ) Rail-to-Rail Signal Handling Small 25-Bump UCSPTM (2.5mm x 2.5mm) and 24-TQFN (4mm x 4mm)
General Description
The MAX4947/MAX4948 analog switches operate from a single +1.8V to +5.5V supply. These switches feature a low 30pF (typ) capacitance for high-speed data switching applications. The MAX4947 is a triple double-pole/double-throw (DPDT) switch, and the MAX4748 is a hex single-pole/doublethrow (SPDT) switch with one control logic input. The MAX4947 has three logic inputs to control the switches in pairs. The MAX4948 has one logic input and an enable input (EN) to disable the switches. The MAX4947/MAX4948 are available in small 24-pin (4mm x 4mm) TQFN and 25-bump (2.5mm x 2.5mm) chip-scale packages (UCSPTM).
MAX4947/MAX4948
Ordering Information
PART MAX4947EBA+* MAX4947ETG+ MAX4948EBA+* MAX4948ETG+ TEMP RANGE -40C to +85C -40C to +85C -40C to +85C -40C to +85C PINPACKAGE 25 UCSP-25 24 TQFN-EP 25 UCSP-25 24 TQFN-EP PKG CODE B25-1 T2444-4 B25-1 T2444-4
Applications
USB Signal Switching UART Signal Switching SDIO/Memory Stick Cell Phones PDAs
* Future product--contact factory for availability. + Denotes lead-free package. EP = Exposed paddle.
UCSP is a trademark of Maxim Integrated Products, Inc.
Typical Operating Circuit appears at end of data sheet.
Functional Diagram
VCC CB12 NO1 COM1 S1 NC1 NO2 COM2 S2 NC2 CB34 NO3 COM3 S3 NC3 NO4 COM4 S4 NC4 CB56 NO5 COM5 S5 NC5 NO6 COM6 S6 NC6 COM6 EN S6 NC6 COM5 S5 NC5 NO6 NO5 COM4 S4 NC4 COM3 S3 NC3 NO4 NO3 COM2 S2 NC2 COM1 S1 NC1 NO2 VCC CB NO1
MAX4947
GND
MAX4948
GND
________________________________________________________________ Maxim Integrated Products
1
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Hex SPDT Data Switch MAX4947/MAX4948
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +6.0V All other pins to GND (Note 1) ......................-0.3V to VCC + 0.3V Continuous Current NO_, NC_, COM_ .......................................................100mA Peak Current NO_, NC_, COM_ (pulsed at 1ms, 50% Duty Cycle)................................200mA (pulsed at 1ms, 10% Duty Cycle)................................300mA Continuous Power Dissipation (TA = +70C) 25-Bump UCSP (derate 12.2mW/C above +70C) ....976mW 24-Pin TQFN (derate 20.8mW/C above +70C) .......1667mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ........................................................150C Storage Temperature Range .............................-65C to +150C Bump Temperature (soldering) Infrared (15s) ...............................................................+220C Vapor Phase (60s) ...........................................................+215C Lead Temperature (soldering) .........................................+300C
Note 1: Signals on CB_, NO_, NC_, COM_, EN exceeding VCC or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +5.5V, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +3V, TA = +25C.) (Notes 2, 3)
PARAMETER POWER SUPPLY Power-Supply Range VCC VCC = 5.5V, VCB_ = 0V or VCC Power-Supply Current ANALOG SWITCH Analog Signal Range VNO_, VNC_, VCOM_, VCC = 2.7V, ICOM_ = 10mA; VNC_ or VNO_ = 0 or VCC VCC = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 0 or VCC VCC = 2.7V, ICOM_ = 10mA; VNC_ or VNO_ = 0 or VCC TMIN to TMAX +25C On-Resistance (Note 4) RON TMIN to TMAX +25C On-Resistance Match Between Channels (Notes 4, 5) RON TMIN to TMAX +25C On-Resistance Flatness (Notes 4, 6) RFLAT TMIN to TMAX +25C NO_ or NC_ Off-Leakage Current INO_(OFF) or VCC = 3.6V; VCOM_ = 3.6V, 0; INC_(OFF) VNO_ or VNC_ = 0, 3.6V VCC = 3.6V; VCOM_ = 3.6V, 0; VNO_ or VNC_ = 3.6V, 0 or unconnected TMIN to TMAX +25C TMIN to TMAX -3 -10 -6 -10 0.5 0.3 0 4.0 VCC 5.5 6.5 0.5 0.6 1 1.2 +3 +10 +6 +10 nA nA V ICC VCC = 2.7V, VCB_ = 1.6V or 0.5V VCC = 5.5V, VCB_ = 1.6V or 0.5V TMIN to TMAX TMIN to TMAX 1.8 5.5 1.0 5 10 A V SYMBOL CONDITIONS TA MIN TYP MAX UNITS
COM_ On-Leakage Current
INO_(ON)
2
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Hex SPDT Data Switch
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.7V to +5.5V, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +3V, TA = +25C.) (Notes 2, 3)
PARAMETER COM_ Off-Leakage Current DYNAMIC Turn-On Time tON VCC = 2.7V; VNO_ or VNC_= 1.5V; RL = 50; CL = 35pF, Figure 1 VCC = 2.7V; VNO_ or VNC_= 1.5V; RL = 50; CL = 35pF, Figure 1 VCC = 2.7V; VNO_ or VNC_= 1.5V; RL = 50; CL = 35pF, Figure 2 (Note 7) VCC = 2.7V; RS = 39; CL = 50pF, Figure 3 VGEN = 0, RGEN = 0, CL = 1nF , Figure 4 Signal = 0dBm, CL = 5pF, RL = 50, Figure 5 CL = 5pF; RL = 50; VCOM_ = 1VP-P, f = 1MHz, Figure 5 (Note 8) CL = 5pF; RL = 50; f = 1MHz, VCOM_ = 1VP-P, Figure 5 (Note 9) NC_ = NO_ = 0V, f = 1MHz Figure 6 VCOM = GND, f = 1MHz (MAX4948), Figure 6 COM_ = 0V, f = 1MHz, Figure 6 +25C TMIN to TMAX +25C TMIN to TMAX +25C TMIN to TMAX TMIN to TMAX +25C +25C 2 100 ns 300 400 800 800 800 800 ns ns SYMBOL ICOM_(OFF) CONDITIONS VCC = 3.6V (MAX4948); VCOM_ = 3.3V, 0.3V; VNO_ or VNC_ = 0, 3V, 3.3V TA +25C TMIN to TMAX MIN -6 -10 TYP MAX +6 +10 nA UNITS
MAX4947/MAX4948
Turn-Off Time
tOFF
Break-Before-Make
tBBM
HIGH-SPEED TIMING CHARACTERISTICS (rising time = 20ns) Skew Charge Injection -3dB Bandwidth tSKEW Q BW 0.2 10 300 ns pC MHz
Off-Isolation
VISO
+25C
-70
dB
Crosstalk NC_ or NO_ Off-Capacitance COM_ Off-Capacitance COM_ On-Capacitance DIGITAL I/O (EN, CB_) Input-Logic High Input-Logic Low Input Leakage Current
VCT CNC_(OFF) CNO_(OFF) CCOM_(OFF) CCOM_(ON)
+25C +25C +25C +25C TMIN to TMAX TMIN to TMAX
-90 15 25 30
dB pF pF pF
VIH VIL ICB VCB_ = 0 or VCC
1.6 0.5 1
V V A
TMIN to TMAX
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3
Hex SPDT Data Switch MAX4947/MAX4948
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.7V to +5.5V, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +3V, TA = +25C.) (Notes 2, 3) Note 2: The algebraic convention is used. The most negative value is shown in the minimum column. Note 3: UCSP parts are 100% tested at TA = +25C. Limits across the full temperature range are guaranteed by correlation and design. TQFN parts are guaranteed by correlation and design at - 40C. Note 4: RON and RON matching specifications are guaranteed by design. Note 5: RON = RON(MAX) - RON(MIN). Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Note 7: Guaranteed by design, not production tested. Note 8: Off-Isolation = 20log10 [VCOM_ / (VNO_ or VNC_)], VCOM_ = output, VNO_ or VNC_ = input to off switch. Note 9: Between any two switches.
Typical Operating Characteristics
(VCC = 3V, TA = +25C, unless otherwise noted.)
ON-RESISTANCE vs. VCOM
MAX4947/48 toc01
ON-RESISTANCE vs. VCOM TEMPERATURE
MAX4947/48 toc02
ON-RESISTANCE vs. VCOM AND TEMPERATURE
VCC = 5V 4 TA = +85C RON () 3 TA = +25C
MAX4947/48 toc03
40 35 30 ON-RESISTANCE () 25 20 15 10 5 0 0 1 2 3 VCOM (V) 4 5 VCC = 2.7V VCC = 3.0V VCC = 2.0V VCC = 1.8V
7 VCC = 3V 6 5 RON () 4 3 2 TA = -40C TA = +85C TA = +25C
5
VCC = 2.3V
2 TA = -40C
VCC = 5.0V
1 1 0 0 0.5 1.0 1.5 VCOM (V) 2.0 2.5 3.0 0 0 1
2 3 VCOM (V)
4
5
NO/NC OFF-LEAKAGE CURRENT vs. TEMPERATURE
MAX4947/48 toc04
COM ON-LEAKAGE CURRENT vs. TEMPERATURE
MAX4947/48 toc05
COM OFF-LEAKAGE CURRENT vs. TEMPERATURE (MAX4748)
VCC = 3V/5V COM OFF-LEAKAGE CURRENT (nA) 1
MAX4947/48 toc06
10 VCC = 3V/5V NO/NC OFF-LEAKAGE CURRENT (nA) 1
10 COM ON-LEAKAGE CURRENT (nA)
VCC = 3V/5V
10
1
0.1 VCC = 5V 0.01 VCC = 3V
0.1
0.1
0.01
VCC = 5V VCC = 3V
0.01
VCC = 5V VCC = 3V
0.001
0.001
0.001
0.0001 -40 -15 10 35 60 85 TEMPERATURE (C)
0.0001 -40 -15 10 35 60 85 TEMPERATURE (C)
0.0001 -40 -15 10 35 60 85 TEMPERATURE (C)
4
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Hex SPDT Data Switch
Operating Characteristics (continued)
(VCC = +3V, TA = +25C, unless otherwise noted.)
MAX4947/MAX4948
CHARGE INJECTION vs. VCOM
MAX4947/48 toc07
SUPPLY CURRENT vs. SUPPLY VOLTAGE
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6
MAX4947/48 toc08
SUPPLY CURRENT vs. TEMPERATURE
MAX4947/48 toc09
25 CL = 1nF 20 CHARGE INJECTION (pC) V+ = 5V V+ = 3V 10
100
SUPPLY CURRENT (nA)
SUPPLY CURRENT (nA)
10
15
VCC = 5V VCC = 3V
1
5
0 0 1 2 3 VCOM (V) 4 5
0.1 -40 -15 10 35 TEMPERATURE (C) 60 85
LOGIC THRESHOLD vs. SUPPLY VOLTAGE
MAX4947/48 toc10
TURN-ON/-OFF TIME vs. SUPPLY VOLTAGE
MAX4947/48 toc11
TURN-ON/-OFF TIMES vs. TEMPERATURE
400 350 300 tON/tOFF (ns) 250 200 150 100 50 0 tOFF, V+ = 5V tON, V+ = 5V tOFF, V+ = 3V tON, V+ = 3V
MAX4947/48 toc12
2.0
1000 900 800 700 tON/tOFF (ns)
450
1.6 LOGIC THRESHOLD (V)
1.2 VIH 0.8 VIL
600 500 400 300 tOFF tON
0.4
200 100
0 1.5 2.5 3.5 4.5 SUPPLY VOLTAGE (V) 5.5
0 1.5 2.5 3.5 4.5 SUPPLY VOLTAGE (V) 5.5
-40
-15
10 35 TEMPERATURE (C)
60
85
FREQUENCY RESPONSE
MAX4947/48 toc13
TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY
MAX4947/48 toc14
SUPPLY CURRENT vs. LOGIC VOLTAGE
VCC = 5.5V 6 SUPPLY CURRENT (A) 5 4 3 2 1
MAX4947/48 toc15
20 0 -20 ON-LOSS (dB) -40 -60 -80 -100 CROSSTALK -120 -140 0.0001 OFF-ISOLATION ON-LOSS
1 RL = 600
7
THD+N (%)
0.1
0.01 0.01 1 100 0.01 0.1 FREQUENCY (MHz) 1 10 FREQUENCY (kHz) 100
0 0 0.5 1.0 1.6 2.0 3.0 4.0 LOGIC VOLTAGE (V) 5.0 6.0
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5
Hex SPDT Data Switch MAX4947/MAX4948
Pin Description
PIN MAX4947 TQFN 1 2 3 4 5 6, 21 7 8 9 10 11 12 13 14 15 16 17 18 19 20 22 23 24 -- -- UCSP D2 D1 C1 C2 B1 A1, C3, D3 B2 A2 B3 A3 A4 B4 A5 B5 C4 C5 D5 D4 E5 E4 E3 E2 E1 -- -- 1 2 3 4 -- 6, 21 7 8 9 10 11 12 -- -- 15 16 17 18 19 20 22 23 24 5 13 MAX4948 TQFN UCSP D2 D1 C1 C2 -- A1, C3, D3 B2 A2 B3 A3 A4 B4 -- -- C4 C5 D5 D4 E5 E4 E3 E2 E1 B1 A5 NC6 NO5 COM5 NC5 CB56 GND COM4 NO4 NC4 NO3 COM3 NC3 CB34 CB12 NC2 COM2 NO2 NC1 NO1 COM1 VCC COM6 NO6 EN N.C. Analog Switch 6. Normally Closed Terminal 6. Analog Switch 5. Normally Open Terminal 5. Analog Switch 5. Common Terminal 5. Analog Switch 5. Normally Closed Terminal 5. Digital Control Input for Analog Switches 5 and 6 Ground Analog Switch 4. Common Terminal 4. Analog Switch 4. Normally Open Terminal 4. Analog Switch 4. Normally Closed Terminal 4. Analog Switch 3. Normally Open Terminal 3. Analog Switch 3. Common Terminal 3. Analog Switch 3. Normally Closed Terminal 3. Digital Control Input for Analog Switches 3 and 4 Digital Control Input for Analog Switches 1 and 2 Analog Switch 2. Normally Closed Terminal 2. Analog Switch 2. Common Terminal 2. Analog Switch 2. Normally Open Terminal 2. Analog Switch 1. Normally Closed Terminal 1. Analog Switch 1. Normally Open Terminal 1. Analog Switch 1. Common Terminal 2. Positive Supply Voltage Analog Switch 6. Common Terminal 6. Analog Switch 6. Normally Open Terminal 6. Enable-Logic In. Drive EN high to set all switches into highimpedance mode. No Connection. Leave N.C. unconnected. Digital Control Input for Analog Switches 1-6. Drive CB low to connect COM_ to NC_ for all six switches. Drive CB high to connect COM_ to NO_ for all six switches. CB is valid only when EN is driven low. If EN is driven high then all switches are high impedance. Exposed Pad. Connect exposed pad to ground. NAME FUNCTION
--
--
14
B5
CB
EP
--
EP
--
EP
6
_______________________________________________________________________________________
Hex SPDT Data Switch
Pin Configurations/Truth Tables
(BUMPS SIDE DOWN)
1 + GND A CB56 B COM5 C VCC 22 NO5 D NO6 E COM6 VCC COM1 NO1 1 NC6 2 NO5 3 COM5 4 NC5 5 CB56 6 GND NC6 GND NC1 NO2 COM6 23 NO6 24 + *EP NC5 GND NC2 COM2 COM4 NC4 NC3 CB12 NO1 19 COM1 20 GND 21 2 NO4
MAX4947/MAX4948
MAX4947
3 NO3 4 COM3 5 CB34
TOP VIEW
COM2 CB12 14 CB34 13 12 11 10 NC3 COM3 NO3 NC4 NO4 COM4 9 8 7 13 12 11 10 NC3 COM3 NO3 NC4 NO4 COM4 N.C. 9 8 *EP 1 NC6 2 NO5 3 COM5 4 NC5 5 EN 6 GND 7 NC1 NO2 NC2 15 NC2 15 ON OFF OFF
18
17
16
MAX4947
UCSP 2.5mm x 2.5mm
TQFN 4mm x 4mm *EXPOSED PADDLE CONNECT TO GROUND
(BUMPS SIDE DOWN)
1 + GND A EN B COM5 C NC5 COM4 2 NO4
MAX4948
3 NO3 4 COM3 5 N.C.
TOP VIEW
NC1 NO2 COM2 CB 14 NC_
18 NC4 NC3 CB NO1 19 COM1 20 GND NC2 COM2 GND 21 VCC 22 NO5 NC6 GND NC1 NO2
17
16
MAX4948
+
D NO6 E COM6 VCC COM1 NO1
COM6 23 NO6 24
UCSP 2.5mm x 2.5mm
TQFN 4mm x 4mm *EXPOSED PADDLE-CONNECT TO GROUND
MAX4947 CB12 0 1 CB34 0 1 CB56 0 1 NO1/NO2 NC1/INC2 OFF ON NO3/NO4 OFF ON NO5/NO6 OFF ON ON OFF NC3/NC4 ON OFF NC5/NC6 ON OFF EN LOW LOW HIGH MAX4948 CB LOW HIGH X NO_ OFF ON OFF
_______________________________________________________________________________________
7
Hex SPDT Data Switch MAX4947/MAX4948
Detailed Description
The MAX4947 triple DPDT and the MAX4948 hex SPDT analog switches operate from a single +1.8V to +5.5V supply. These devices are fully specified for +3V applications. The MAX4947/MAX4948 have a guaranteed 4 (typ) onresistance and a low 30pF (typ) capacitance that makes the switch ideal for data switching applications. The MAX4947 has three logic inputs to control two switches in pairs and the MAX4948 has one logic control input and an enable input (EN) to disable the switches.
Analog Signal Levels
The on-resistance of the MAX4947/MAX4948 is very low and stable as the analog input signals are swept from ground to V CC (see the Typical Operating Characteristics). These switches are bidirectional, allowing NO_, NC_, and COM_ to be configured as either inputs or outputs.
Power-Supply Biasing
Power-supply bypassing improves noise margin and prevents switching noise to propagate from VCC supply to other components. A 0.1F capacitor connected from V+ to GND is adequate for most applications.
Applications Information
Digital Control Inputs
The MAX4947/MAX4948 provide a digital control logic input, CB_. CB_ controls the position of the switches as shown in the Pin Configurations/Truth Tables. Driving CB_ rail-to-rail minimizes power consumption. The MAX4948 features an EN input to turn all switches on or off. When EN is driven high, CB is disabled, and the analog inputs enter a high-impedance state. Drive EN low to turn the switches on and enable CB.
Power-Supply Sequencing
CMOS devices require proper power-supply sequencing. Always apply VCC before the analog signals, especially if the input signal is not current limited.
UCSP Applications Information
For the latest application details on UCSP construction, dimensions, tape carrier information, printed circuit board techniques, bump-pad layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, go to the Maxim website at www.maxim-ic.com/ucsp for the Application Note: UCSP-A Wafer-Level Chip-Scale Package.
Timing Circuits/Timing Diagrams
MAX4947/ MAX4948
VN_ NO_ OR NC_
VCC VCC COM_ LOGIC INPUT VOUT RL CB_ CL VOUT SWITCH OUTPUT 0V 0.9 x V0UT VCC 0V 50%
t r < 5ns t f < 5ns 50%
t OFF 0.9 x VOUT
LOGIC INPUT
GND
t ON
VOUT = VN_
CL INCLUDES FIXTURE AND STRAY CAPACITANCE. RL RL + RON
(
)
IN DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH.
Figure 1. Switching Time
8
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Hex SPDT Data Switch
Timing Circuits/Timing Diagrams (continued)
MAX4947/ MAX4948
VN_ NC_ NO_ CB_ LOGIC INPUT GND VOUT tBBM CL INCLUDES FIXTURE AND STRAY CAPACITANCE. 0.9 x VOUT COM_ RL VCC VCC VOUT LOGIC INPUT VCC 50% 0V
MAX4947/MAX4948
CL
Figure 2. Break-Before-Make-Interval
tri 50% TxD+ Rs A+ * * MAX4947/MAX4948 * * * * * TxDRs Rs = 39 CL = 50pF ABCL OUTPUT B90% 50% 10% 50% B+ CL INPUT A90% 50% INPUT A+ 10%
90%
tskew_i
10% tfi
tro
90%
OUTPUT B+
tskew_o
10% tfo
|tro - tri| DELAY DUE TO SWITCH FOR RISING INPUT AND RISING OUTPUT SIGNALS. |tfo - tfi| DELAY DUE TO SWITCH FOR FALLING INPUT AND FALLING OUTPUT SIGNALS.
|tskew_o| CHANGE IN SKEW THROUGH THE SWITCH FOR OUTPUT SIGNALS. |tskew_i| CHANGE IN SKEW THROUGH THE SWITCH FOR INPUT SIGNALS.
Figure 3. Input/Output Skew Timing Diagram
_______________________________________________________________________________________ 9
Hex SPDT Data Switch MAX4947/MAX4948
Timing Circuits/Timing Diagrams (continued)
V CC
MAX4947/ MAX4948
RGEN NC_ OR NO_ GND CB_
VOUT VOUT VOUT CL CB_ OFF ON OFF
V CC COM_
V GEN
VIL TO VIH
CB_
OFF
ON Q = (V OUT )(C L )
OFF
LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES THAT HAVE THE OPPOSITE LOGIC SENSE.
Figure 4. Charge Injection
+5V 10nF NETWORK ANALYZER 0V OR V+ CB_ VCC COM1 VCB_ 50 50 V OFF-ISOLATION = 20log OUT VCB_.> ON-LOSS = 20log VOUT VCB_.> VOUT VCB_.>
NC1 50
MAX4947/ MAX4948
NO1* GND
CROSSTALK = 20log VOUT MEAS REF
50
50
MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND OFF NO_ OR NC_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND ON NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
*FOR CROSSTALK THIS PIN IS NO2. NC2 AND COM2 ARE OPEN.
Figure 5. On-Loss, Off-Isolation, and Crosstalk
10nF VCC
VCC COM_
MAX4947/ MAX4948
CB_ VIL OR VIH
CAPACITANCE METER f = 1MHz
NC_ or NO_ GND
Figure 6. On-Loss, Off-Isolation, and Crosstalk
10 ______________________________________________________________________________________
Hex SPDT Data Switch
Typical Operating Circuit
VCC
MAX4947/MAX4948
CB CLK NO1 NC1 CMD NO2 NC2 S2 S1
LOGIC
EN
COM1
COM2
DAT0 SD I/O 1 DAT1
NO3 NC3 NO4 NC4 S4 COM4 S3 COM3 SD HOST
DAT2
NO5 NC5 S5 COM5
DAT3
NO6 NC6 S6 COM6
CLK
MAX4948
CMD GND
DAT0 SD I/O 2 DAT1
DAT2
DAT3
Chip Information
PROCESS: CMOS
______________________________________________________________________________________ 11
Hex SPDT Data Switch MAX4947/MAX4948
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
25L, UCSP.EPS
PACKAGE OUTLINE, 5x5 UCSP 21-0096 H
1 1
12
______________________________________________________________________________________
Hex SPDT Data Switch
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
24L QFN THIN.EPS
MAX4947/MAX4948
Revision History
Pages changed at Rev 1: 1.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13
(c) 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

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